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Saturday, July 25, 2020 | History

2 edition of Isothermal aging of vapor deposited aluminum-copper alloy films found in the catalog.

Isothermal aging of vapor deposited aluminum-copper alloy films

William C. McBee

Isothermal aging of vapor deposited aluminum-copper alloy films

by William C. McBee

  • 72 Want to read
  • 38 Currently reading

Published .
Written in English

    Subjects:
  • Aluminum-copper alloys.

  • Edition Notes

    Statementby William C. McBee.
    The Physical Object
    Pagination[6], 36 leaves, bound :
    Number of Pages36
    ID Numbers
    Open LibraryOL14241366M

    When the iron‐carbon alloys are oxidized at °C in oxygen at 10 Torr, a decarburized zone appears in the alloy substrate near the oxide‐metal interface. This means that, under the experimental conditions, the rate of diffusion of carbon from the alloy substrate exceeds the rate of diffusion of iron into the ://   Thermal spraying p. 1 Change in graphite structure of cast iron coatings through the process of plasma Original surface treatment of copper alloy in ancient Roman empire: chemical patination on Roman strigil p. Deposition of aluminium nitride films by plasma enhanced chemical vapor deposition p.

    JTE Effect of Silver Addition on Mechanical Properties and Stress Corrosion Cracking in a Predeformed and Overaged Aluminum Alloy - 01 September JTE Seal Strength Evaluation of Flexible Plastic Films by Machine Testing and Human Peeling - 01 July   In electronic packages, copper lead-frames are usually plated with 5-μm- to μm-thick Sn or Sn-rich alloy (e.g., eutectic Sn-Cu) to serve as a wetting enhancer during subsequent soldering for lead attachment, and to reduce oxidation and corrosion of the ntly, Sn whiskers, which may be hundreds of micrometers long, extrude from the electroplated surface during long-term

    Fifty nanometers of Al 2 O 3 and TiO 2 nanolaminate thin films deposited by atomic layer deposition (ALD) were investigated for protection of copper in M NaCl using electrochemical techniques. Coated samples showed increases in polarization resistance over uncoated copper, up to 12 MΩ-cm 2, as measured by impedance ://   The aging process of the alloy was investigated by differential scanning calorimetry (DSC) analysis and transmission electron microscopy (TEM). The results show that two kinds of phases, i.e. S(Al2CuMg) and sigma(Al5Cu6Mg2), precipitate from matrix and improve the tensile strength of the alloy efficiently at both the ambient and elevated


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Isothermal aging of vapor deposited aluminum-copper alloy films by William C. McBee Download PDF EPUB FB2

Download PDF: Sorry, we are unable to provide the full text but you may find it at the following location(s): (external link) Aluminum-4 wt.% copper alloy films were prepared by vapor deposition and examined for grain growth in the temperature range °–°C.

The results show that growth occurs in accordance with the empirical equation D = (Kt) term n, with a value ofwas found to be independent of temperature.A discrete activation energy of 30 kcal/mol was calculated for the :// A similar behavior was previously observed by Buha et al. () in aluminum alloy treated to T6Ix condition via DSC and TEM analysis.

The secondary precipitation leads to a significant increase on the precipitation density of the η′ phase and then contributes to the enhanced fracture toughness of an Al–Mg–Si–Cu alloy (Buha et al 'Isothermal aging of vapor deposited aluminum-copper alloy films' -- subject(s): Aluminum-copper alloys 'Sulfur construction materials' -- subject(s): Sulphur in Crystal structure and surface morphology of electroless copper films deposited from solutions containing 2,2′-dipyridyl were investigated by X-ray diffraction and electron microscopic :// KannanM.

Bobby, ShuklaP.K., in Stress Corrosion Cracking, Aluminum-copper alloy. Aluminum-copper alloys are of two types: (i) alloys containing copper and aluminum (known as aluminum bronze) and (ii) alloys containing copper, aluminum and zinc (known as aluminum brass).

Ateya et al. () reported that aluminum-bronze (93 Cu–7 Al) is susceptible to SCC in chloride-containing   B.C. Valek and J.M. Hampikian, “Silica Thin Films Applied to NiCr Alloy via Combustion Chemical Vapor Deposition,” Surface and Coatings Technology, J.M.

Hampikian, B.C. Valek and M.R. Hendrick, “Combustion CVD-Deposited Oxidation Resistant Coatings,” Electrochemical Society Proceedingspp. Sulphur-concrete is obtained by adding sulphur to a concrete mix instead of portland cement and is claimed to be corrosion resistant, of high strength, and with fast-curing time.

SULPHUR is the Aluminum alloys used in aeronautical industry are susceptible to corrosion. The solution to this problem is base chromate materials, which have been heavily regulated and restricted.

The development of alternatives begins in the s and the s, where some potential methodologies were established. The sol-gel process is one of these methods, in which thin oxide layers are deposited on the Phase separation in immiscible silver–copper alloy thin films. electrode atom probe after isothermal aging at K and K for times up to 3,h.

in co-deposited alloy thin films is @article{osti_, title = {Kinetics of sublimation of copper(II) acetylacetonate complex used for chemical vapor deposition of copper films}, author = {Pauleau, Y and Fasasi, A Y}, abstractNote = {The kinetics of sublimation of copper(II) acetylacetonate complex, Cu(C{sub 5}H{sub 7}O{sub 2}){sub 2}, in pure hydrogen or argon was investigated by isothermal thermogravimetry at a temperature   Vapor Deposition T hin film batteries are built layer by layer by vapor deposition.

The resulting battery is formed of parallel plates, much as an ordinary battery construction, just much thinner. The figure (Fig. 1) shows an example of a thin film battery layout where films are deposited symmetrically onto both sides of a supporting ://   徐惠彬 职称职务:教授,博士生导师,中国工程院院士,北京航空航天大学校长 所在单位:材料科学系 专业方向代码: 联系电话: 电子邮箱:[email protected] 办公地点: 2 days ago  Surface and Coatings Technology is an international archival journal publishing scientific papers on surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance.

Contributions range from original   “A quantitative study of preeipitation of metastable phases in an Al at%Cu alloy during isothermal aging at K”, J. Jap. Inst. Met. 72, (). Souda R. “Roles of deeply supercooled ethanol in crystallization and salvation of Li”, J. Phys. Chem. B, (9), ().

The microstructure of β‐metastable Ti–3Mo–6Sn–6Al (mol%) alloy is systematically investigated before and after isothermal aging. The α″ phase (orthorhombic) forms during isothermal aging.

No composition change is detected on the isothermal α″ :// The U.S. Department of Energy's Office of Scientific and Technical Information   Purchase Rapidly Quenched Metals - 1st Edition. Print Book & E-Book. ISBNVol Is November ISSN: (Print) X (Online) Study of Height Reduction of Sn99Cu1/Cu Solder Joints as a Result of Isothermal Aging.

Bipolar Switching Behavior of ZnO x Thin Films Deposited by Metalorganic Chemical Vapor Deposition at Various Growth Temperatures. Seonho Bae, Dae Isothermal oxidation behavior of NiCr and NiCrAlY coatings deposited onto low alloy 16Mo3 steel by HVAF process was investigated in 5% O 2 + 20% H 2 O + N 2 at °C for h.

Whereas NiCrAlY showed lower mass gain compared to NiCr, both coatings succeeded in maintaining the integrity with the substrate during the exposure without any.

The patterns for the vapor-deposited glasses are very similar, but the peak intensity of Cu 10 Zr 7, AlCu, and Al 3 Zr 2 phases increases as the deposition rate is increased, indicating the effect   L.D.

Xie, Y.H. Sohn, E.H. Jordan and M. Gell, “The Effects of Bond Coat Grit Blasting on the Durability and Thermally Grown Oxide Stress in an Electron Beam Physical Vapor Deposited Thermal Barrier Coatings,” Surface and Coatings Technology, Vol.

() pp. A copper sheet with of % purity was used as the soluble anode without any additives in the solutions. The cathode substrate was a mm thick sheet of cold-rolled MP35N alloy, which has a fcc structure and {} out of plane texture The CuSO 4 concentration was 28 g l −1 and the pH value was adjusted to by the addition of H 2 SO ://